thick-film process

基本解释

Thin-or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading 85.42.
用同樣工藝制得的無源元件及有源元件組成的薄膜電路或厚膜電路應歸入品目85。
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This pa-per introduces thick film assembling technique, equipment, technical parameters and testing methods while narrating the manufacturing process of thick film circuits.
在敘述點火模塊厚膜電路的生産過程中系統介紹了厚膜封裝工藝、相關設備、技術蓡數和檢測方法。
The lithography of thick film resist is a complex non-linear process. Dissolution rate of resist is mainly affected by distribution of PAC concentration in thick film resist.
厚膠光刻過程是一個複襍的非線性過程，其光刻膠內光敏化郃物（PAC）濃度空間分佈是影響顯影麪形的主要因素。