bga
基本解释
- (ball grid array, 球狀矩陣排列)
英汉例句
- Fitting option BGA nozzle ensures excellent result and efficient.
選購專用BGA風咀,使拆銲傚果更佳及操作更快捷。 - Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形銲點陣列封裝需要倒裝銲。 - This method meets the needs of the on-line test of BGA coplanarity.
該測量方法可以滿足BGA(球腳陣列)封裝引腳尺寸的實時在線檢測的需要。 - BGA measurement is measured for inside solder point.
BGA量測以最內側銲點爲量測依據。 - This procdure provides instruction for lead free BGA reballing process.
該程序爲無鉛。